德尔福笔试题目

德尔福笔试题目

　卷子好象共有三种，电子，机械和软件，我们这个教室学自动化的全做的是Mechanical Engineering的，可完了听系上在另外一个教室的同学说他们做的5a880faf6f应届生求职网YingJieSheng.COMc350ade2a4是软件的`，看来不完全对口的做什么就没准了到清华应该会换题的，只是给大家看看方向做个参考：

1,Briefly describe what is blanking(cutting),forming,coining and embossing　in stamping process.

2,What is metal clading? 3,What is the purpose of adding glass fiber to thermoplastic material?

4,In contrast with metal and thermoplastic material,which has a higher　coefficient of thermal　expansion(CTE).

5,The most suitable material for a integral hinge design(typical plastic　thickness=0.25 to 0.5mm at hinge)

6,Can a bending load makes both compressive and tensile stress in a member?

7,What is the design criteria used in plastics catch/snap?

8,What is FEA?

9,Why is natural frequency important in vibration analysis?

10,What is the deflection equation of a cantilever beam fixed at one edge?

考软件的同学说是一些汇编，单片机，C，等等，对于我们专业来说还要更对口更简单些